کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
546707 1450540 2016 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts
چکیده انگلیسی


• Ni/Ni–P stacks are studied for corrosion resistance in mixed flow gas and salt spray.
• Thicker Ni-P improves corrosion resistance in the mixed flow gas test.
• However, a thicker Ni–P layer performs the worst in the salt spray test.
• Corrosion mechanism is understood through analysis of corrosion pits and residues.

Atmospheric corrosion has vast consequences on the reliability of electronic connectors. This study determined the corrosion resistance of Ni/Ni–P plating metallurgy as a function of plating current density and plating thickness. Discrepancy was observed in the neutral salt spray (NSS) and mixed flowing gas (MFG) tests. Thicker Ni–P deposits displayed superior corrosion resistance in MFG tests while thinner Ni–P deposits performed better in NSS tests. This disparity was attributed to the intrinsic corrosion susceptibility of Ni–P against chlorine or sulfur assisted corrosion. Corrosion products were analysed for better understanding of the corrosion mechanism. NSS test produced green corrosion residues consisting of CuCl (nantokite) and CuCl2(OH)3 (clinoatacamite) and brown residues consisting of Cu2O (cuprite). MFG test produced sulfides of copper (major) and nickel (minor).

Figure optionsDownload as PowerPoint slide

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 60, May 2016, Pages 84–92
نویسندگان
, , , , , ,