کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
546811 871943 2014 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Texture of electrodeposited tin layers and its influence on their corrosion behavior
ترجمه فارسی عنوان
بافت لایه های الکترودی شده و اثر آن بر رفتار خوردگی آنها
کلمات کلیدی
تجزیه و تحلیل بافت، لایه قلع الکترودهایی، خوردگی قلع، پراش اشعه ایکس، ویسکر
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی


• Grain orientation of Sn layers depends on current density and layer thickness.
• Corrosion of differently orientated tin layers does not depend on grain size.
• (3 2 1)/(2 2 0) texture prevents corrosion, while (1 1 2)/(1 0 1) texture enhances corrosion.
• Crystallographic model of tin surface may explain slow corrosion for (3 2 1)/(2 2 0).

Differences in the degree of corrosion of pure thin tin films electrodeposited on copper substrates were investigated in dependence on the layer thickness and the texture of the tin layers. The change of the preferred orientation of the tin layer deposited by applying different current densities was analyzed using X-ray diffraction. A graphical evaluation was used to determine the degree of corrosion after sample exposition to NaCl contaminations and humidity. Results show that a preferred orientation along the lattice planes (3 2 1) and (2 2 0) enhances the corrosion resistance of the tin layer by about one order of magnitude compared to a non-textured sample based on the corroded area. In contrast, a texture along (1 0 1) and (1 1 2) accelerates the oxidation of tin by a factor of about three to four compared with a randomly orientated specimen. The corrosion dependence on the preferred orientation decreases with increasing layer thickness. Moreover, scanning electron micrographs show no effect to the size of the tin grains on variations of the current density. In summary, changes in the process parameters of the electrodeposition lead to a variation of texture and thus modify the chemical and corrosion properties of the resulting tin layers. Consequently reliability properties like solderability or whisker growth in further applications depend on these parameters.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 54, Issue 11, November 2014, Pages 2578–2585
نویسندگان
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