کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
547052 | 871975 | 2012 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Studies on the reliability of power packages based on strength and fracture criteria
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is if the failure mechanism changes and if it depends on loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal–mechanical analyses and interface fracture mechanics applying the cohesive zone approach. By the latter, critical states for delamination failures could be derived. Finally, critical interface fracture parameters of the package were compared with results from the button shear test.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 52, Issue 7, July 2012, Pages 1255–1265
Journal: Microelectronics Reliability - Volume 52, Issue 7, July 2012, Pages 1255–1265
نویسندگان
Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel,