Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible process

The breakdown failure mechanisms for a family of power AlGaN/GaN HEMTs were studied. These devices were fabricated using a commercially available MMIC/RF technology with a semi-insulating SiC substrate. After a 10 min thermal annealing at 425 K, the transistors were subjected to temperature dependent electrical characteristics measurement. Breakdown degradation with a negative temperature coefficient of −0.113 V/K for the devices without field plate was found. The breakdown voltage is also found to be a decreasing function of the gate length. Gate current increases simultaneously with the drain current during the drain-voltage stress test. This suggests that the probability of a direct leakage current path from gate to the 2-DEG region. The leakage current is attributed by a combination of native and generated traps/defects dominated gate tunneling, and hot electrons injected from the gate to channel. Devices with field plate show an improvement in breakdown voltage from ∼40 V (with no field plate) to 138 V and with lower negative temperature coefficient. A temperature coefficient of −0.065 V/K was observed for devices with a field plate length of 1.6 μm.