Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Flexible printed circuit boards (FPCBs) are being used extensively in current electronics devices because of their excellent flexibility, light weight, and reduced thickness. In the present study, a proposed novel approach that utilizes FPCB as a substrate for motherboards is investigated. Deflection and stress are the key factors that determine the feasibility of FPCB motherboards. As flow velocity increases, flow-induced deflection and stress also become more prominent. The present study also explores several configurations of the motherboard, such as different fastening options and component layouts. This fluid–structure interaction (FSI) study is performed using the fluid solver FLUENT and the structural solver ABAQUS, coupled online using the Mesh-based Parallel Code Coupling Interface (MpCCI). A simple experiment was also conducted to substantiate the FSI simulation technique utilized in the present study. Although the present study on FPCB primarily focuses on the motherboard, the findings could also provide information for other FPCB applications.