The influence of assisted ion beam bombardment on structure and electrical characteristics of HfSiO dielectric synthesized by DIBSD

We have investigated the influence of assisted ion beam bombardment on structure and electrical properties of HfSiO dielectrics deposited on Si (1 0 0) substrate by dual-ion beam sputtering deposition (DIBSD). The X-ray photoelectron spectroscopy (XPS) analysis indicates that assisted ion beam bombardment could suppress the formation of Si clusters and partial SiO bonds. The excellent electrical properties with maximum dielectric constant (18.6) and the smaller oxide-charge density (7.2 × 1011 cm−2) and leakage current (2.8 × 10−7 A/cm2 at (Vfb−1) V) were obtained for HfSiO film by assisted ion beam bombardment at AIE = 100 eV, which provide a initial energy for the formation of film, activate the substrate surface atoms, enhance the polarization rate and improve the film surface compact and adhesion.