کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
547390 871995 2011 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal reliability of VCO using InGaP/GaAs HBTs
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Thermal reliability of VCO using InGaP/GaAs HBTs
چکیده انگلیسی

Degradations of InGaP/GaAs heterojunction bipolar transistor (HBT) collector current and base current subjected to cumulative long-term junction temperature stress are examined experimentally. The aged SPICE model parameters as a function of stress time are extracted from the measurement data. The VCO phase noise, tuning range, and output amplitude are studied in circuit simulation. The phase noise increases, tuning range and output amplitude decrease with increasing junction temperature.


► In this study we examine experimentally HBT’s currents subjected to long-term stress.
► The aged SPICE parameters versus stress time are extracted from measurement.
► We then study the VCO’s phase noise and tuning range in circuit simulation.
► We find that phase noise increases and tuning range decrease with junction temperature.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issue 12, December 2011, Pages 2147–2152
نویسندگان
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