کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
547412 | 871995 | 2011 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issue 12, December 2011, Pages 2298–2305
Journal: Microelectronics Reliability - Volume 51, Issue 12, December 2011, Pages 2298–2305
نویسندگان
A. Agwai, I. Guven, E. Madenci,