کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
547412 871995 2011 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory
چکیده انگلیسی

This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issue 12, December 2011, Pages 2298–2305
نویسندگان
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