کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
547542 1450558 2007 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Modeling of the breakdown mechanisms for porous copper/low-k process flows
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Modeling of the breakdown mechanisms for porous copper/low-k process flows
چکیده انگلیسی

The lifetime of porous low-k dielectrics has been observed to degrade as a function of porosity. This paper demonstrates that pores disturb the electric field within a dielectric through finite element simulation. The disturbance of electric field extends beyond the pore itself. A model of charge transport has been developed to demonstrate the sensitivity of leakage currents in a dielectric to porosity.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 47, Issues 9–11, September–November 2007, Pages 1478–1482
نویسندگان
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