Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles

Temperature mapping in two IGBT modules cooled by a thermosyphon-based system is performed under realistic power mission profiles. The power mission profiles are inferred from a traction design tool results based on feedback data extracted from the field, in which the service line, the train characteristics, and its speed profile are taken into account. Thereby, the chips which are more prone to fail due to a temperature-activated failure are detected by means of the experienced thermal cycles.