Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs

The present status, successes, challenges and future of Ta2O5, and mixed Ta2O5-based high-k layers as active component in storage capacitors of nanoscale DRAMs are discussed. The engineering of new Ta2O5-based dielectrics (doped Ta2O5 and multicomponent Ta2O5-based high-k dielectrics) as well as of metal/high-k interface in MIM capacitor configuration are identified as critical factors for further reduction of EOT value below 1 nm.