کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
547687 1450560 2007 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
چکیده انگلیسی

An evaluation method using the modified hole injection method is proposed to evaluate Negative Bias Temperature Instability (NBTI) in this paper. The physical backgrounds of the evaluation method are strictly discussed. The proposed method accelerates the degradation such as the threshold voltage (Vth) shift by the amount of the hole injection without the high gate voltage stress. Our experimental and theoretical frameworks clarify that two degradation mechanisms, one follows the reaction–diffusion (R–D) model and another follows the hole trap/de-trap (HTD) model, coexist in NBTI. In the inversion layer, holes distributed in the quantized upper energy levels especially induce the degradation that follows the R–D model, and holes distributed in the ground energy level induce the degradation that follows the HTD model. Finally, the accurate NBTI lifetime prediction is demonstrated using the proposed acceleration method.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 47, Issues 2–3, February–March 2007, Pages 409–418
نویسندگان
, , , , ,