Improved inductive-system-level IEC ESD performance for automotive applications using mutual ballasted ESD protection technique

• Inductive IEC ESD stress causes unexpected damage.
• Damage is due non uniformity of conduction with slow risetime.
• Window failure can occur under this condition.
• Mutual ballasting layout technique improves performance dramatically.
• Minimal impact on the area of the ESD cell

A new ESD failure mode under inductive IEC stress of automotive Controller Area Network (CAN) bus is identified. Inductor saturation causes increase of the rise-time from 1 ns to ~ 20 ns, leading to non-uniform conduction in the bidirectional ESD protection circuit. A novel mutual ballasting layout technique is introduced to recover the system level ESD performance.