Thermal resistance investigations on new leadframe-based LED packages and boards

In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board.