کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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548350 | 1450555 | 2008 | 11 صفحه PDF | دانلود رایگان |
This study examined the effects of isothermal aging and temperature–humidity (TH) treatment of substrate on the joint reliability of a Sn–3.0Ag–0.5Cu (wt.%)/organic solderability preservative (OSP)-finished Cu solder joint. Two types of OSP-finished chip-scale-package (CSP) substrates were used, those subjected and not subjected to the TH test. This study revealed an association between the interfacial reaction behaviors, void formation and mechanical reliability of the solder joint. Many voids were formed at the interface of the OSP-finished Cu joint subjected to the TH test. These voids were caused by the oxidation of the OSP-finished Cu substrate during the TH test. In the shear tests, the shear force of the joint with the substrate not subjected to the TH test was slightly higher than that with the TH test. The mechanical reliability of the solder joint was degraded by voids at the interface.
Journal: Microelectronics Reliability - Volume 48, Issues 11–12, November–December 2008, Pages 1864–1874