کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
548368 872209 2008 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Deposition of aerosol (“hygroscopic dust”) on electronics – Mechanism and risk
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Deposition of aerosol (“hygroscopic dust”) on electronics – Mechanism and risk
چکیده انگلیسی

In this paper the risk associated with deposition of aerosol (“hygroscopic dust”) on printed circuit boards is assessed for different equipment designs and deployment. The amount of deposited dust is related to (1) the total dust availability in a given type of equipment and (2) to the rate of deposition of dust due to different mechanisms. Of these, the Brownian diffusion, gravitational settling, thermophoresis and electrophoresis are of different relative importance depending on such design factors as air flow in the enclosure, temperature gradients between boards and walls and presence of electric fields. The expressions for electric fields in the vicinity of printed circuit boards relevant to electrophoretic deposition are derived. It is shown that not only the sealed Absolute Humidity Control Modules but also the breathing Relative Humidity Control Modules should not present a hygroscopic dust risk for either indoor or outdoor applications. Direct air cooled system with forced convection present a definite dust reliability risk both for indoor and outdoor applications while open natural convection cooled systems present a borderline case where each design has to be considered separately.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 48, Issue 4, April 2008, Pages 584–593
نویسندگان
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