کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
548372 872209 2008 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies
چکیده انگلیسی

The behavior of thermomechanically loaded collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies with high (LTCC/FR-4; ΔCTE ⩾ 10 ppm/°C) and low (LTCC/Arlon; ΔCTE < 10 ppm/°C) global thermal mismatches was studied by exposing the assemblies into two thermal cycling tests. The characteristic lifetimes of the LTCC/FR-4 assemblies, tested over the temperature ranges of 0–100 °C and −40 to 125 °C, were 1475 and 524 cycles, respectively, whereas the corresponding values of the LTCC/Arlon assemblies were 5424 and 1575 cycles. According to the typical requirements for the industrial lifetime duration of solder joints, the former values are inadequate, whereas the latter are at an acceptable level in a few cases. Furthermore, the global thermal mismatch affected the thermal fatigue behavior of the 95.5Sn4Ag0.5Cu spheres in the temperature range of −40 to 125 °C.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 48, Issue 4, April 2008, Pages 622–630
نویسندگان
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