Embedded packaging and assembly; Reliability and supply chain implications

• Embedded packaging reorders manufacturing operations rising yield management trade-offs.
• Embedded assembly requires assemblers become comfortable handling fragile, bare die.
• Limited rework potential for embedded packages forces a completely new manufacturing model.

Embedding active and passive components in an interconnect substrate offers improved performance by cutting interconnect parasitics, reliability gains through elimination of wire-bonds and solder-bumps, and reduced cost and size via parts list reduction. Like every new development, these benefits come at a price: disrupted supply chain logistics, yield management complications and limited rework and repair options. Reliability considerations for embedded components include yield management strategies, WEEE and ROHS compliance, application specific life expectancy, and supply chain restructuring. The course also covers cost and warranty implications and concludes reviewing the drivers behind embedded active and passive components along with analysis of multiple examples in today’s real life embedded component applications.