Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure modes as creep and fatigue. The above paper focuses on the experimental measurements and corresponding analysis with the microindentation tests of the SAC 405 solder alloy due to creep and fatigue. The creep, resulting from the application of a constant load during a long time, is represented by an original law between the indenter displacement and time. The fatigue due to repeated loading–unloading cycles is characterized by the law of Manson–Coffin which is adapted for connecting the plastic indentation strain to the number of cycles.