Recent results with HV-CMOS and planar sensors for the CLIC vertex detector

The physics aims for the future multi-TeV e+e− Compact Linear Collider (CLIC) impose high precision requirements on the vertex detector which has to match the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of 3μm, 10 ns time stamping capabilities, low mass (∼0.2% X0 per layer), low power dissipation and pulsed power operation. Recent results of test beam measurements and Geant4 simulations for assemblies with Timepix3 ASICs and thin active-edge sensors are presented. The 65 nm CLICpix readout ASIC with 25μm pitch was bump bonded to planar silicon sensors and also capacitively coupled through a thin layer of glue to active HV-CMOS sensors. Test beam results for these two hybridisation concepts are presented.