New conductive thick-film paste based on silver nanopowder for high power and high temperature applications

A new thick-film material for screen-printing technology, based on nanoscale silver powders with the particle size distribution 5–55 nm is presented. Silver nanopowder used for paste preparation was elaborated by the authors. The compatibility of investigated paste was proven with alumina, silicon, Kapton foil and glass. The main advantage of this paste is sinterability at much lower temperatures (around 300 °C) compared to pastes obtained from micro-powders (650–850 °C). The thicknesses of obtained layers are 2–3 μm. The elaborated layers are dense and well sintered, exhibit good adhesion to all above mentioned substrates and low resistivity as well as very good resistance to high power and elevated temperatures. The results of loading the layers deposited on alumina substrates with high current and exposed to high temperature are presented as well.