کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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549350 | 872362 | 2011 | 8 صفحه PDF | دانلود رایگان |
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials in micro-scale and nano-scale. The presented paper focuses on an application of the nanoindentation technique to extract the basic elastic and elasto-plastic mechanical properties through numerical approaches.In order to extract the elasto-plastic material data of the investigated thin layers the numerical process was designed. Firstly, the nanoindentation process was prepared as finite-element model (FEM). Then, the results were compared to the measurements and processed by the numerical optimization algorithms.
Journal: Microelectronics Reliability - Volume 51, Issue 6, June 2011, Pages 1046–1053