کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
549352 | 872362 | 2011 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A simulation of the board-level drop-test is performed to evaluate some WL-CSP (wafer-level chip-scale packages) performances. An elasto-plastic model is applied on both solder bump and copper pad materials. It intends to demonstrate that copper plasticity is mandatory due to the large plastic strain occuring in these materials. A statistical analysis discusses the required accuracy for the modeling analysis. This analysis is combined with a components’ lifetime prediction based on a representative plastic strain. Finally, it is possible to do a relatively fast calculation while meeting the determined accuracy.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issue 6, June 2011, Pages 1060–1068
Journal: Microelectronics Reliability - Volume 51, Issue 6, June 2011, Pages 1060–1068
نویسندگان
Cédric Le Coq, Adellah Tougui, Marie-Pascale Stempin, Laurent Barreau,