کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
549356 | 872362 | 2011 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Investigation on hot-carrier-induced degradation of SOI NLIGBT
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The hot-carrier-induced (HCI) degradations of silicon-on-insulator (SOI) lateral insulated gate N-type bipolar transistor (NLIGBT) are investigated in detail by DC voltage stress experiment, TCAD simulation and charge pumping test. The substrate current Isub and on-state resistance Ron at different voltage stress conditions are measured to assess the HCI effect on device performance. The electric field and impact ionization rate are simulated to assist in providing better physical insights. And charge pumping current is measured to determinate the front-gate interface states density directly. The degradation mechanisms under different gate voltage stress conditions are then presented and summarized.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issue 6, June 2011, Pages 1097–1104
Journal: Microelectronics Reliability - Volume 51, Issue 6, June 2011, Pages 1097–1104
نویسندگان
Shifeng Zhang, Yan Han, Koubao Ding, Bin Zhang, Jiaxian Hu,