Vibration reliability test and finite element analysis for flip chip solder joints

Vibration fatigue test and analysis methodology for flip chip solder joint fatigue life assessment have been developed by performing vibration tests with constant G-level and varying G-level input excitation. The linear cumulative damage analysis method (Miner’s rule) predicts non-conservative result for vibration fatigue life of flip chip solder joint. Finite element analysis (FEA) using a global-local-beam modeling method was used to calculate the natural frequency and were compared to experimental data. A quasi-static finite element analysis method was developed to investigate solder joint stress strain behavior for solder joint vibration fatigue life prediction. Harmonic finite element analysis was also carried out to predict solder joint fatigue life. Results from quasi-static analysis and harmonic analysis were compared. Based on Miner’s rule and stress amplitude results from FEA results, different assumed cumulative damage index (CDI) factors were investigated in fatigue life prediction.