کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
549753 | 872404 | 2007 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this paper the response spectra analysis is introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to an impact acceleration pulse of a half-sine waveform. The JEDEC drop test condition B is specifically chosen to investigate transient structural responses of a board-level test vehicle comprised of a test board and a mounted package during the drop impact process. Comparisons are made between computed and measured longitudinal strains on the test board as well as time integration and response spectra solutions for stresses in the solder joint.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 47, Issue 12, December 2007, Pages 2188–2196
Journal: Microelectronics Reliability - Volume 47, Issue 12, December 2007, Pages 2188–2196
نویسندگان
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai,