کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6703555 | 1428514 | 2018 | 42 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی عمران و سازه
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this paper a micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids is proposed to predict the thermal conductivities of plain woven C/SiC composite. This model is based upon the analysis of the representative volume element (RVE) models of composite. The modeling strategy starts with a geometrical description and finite element discretization on two scales consisting of the fiber yarn modeling (fiber-scale) followed by a woven fabric modeling (yarn-scale). The PyC interphase is introduced in the fiber-scale modeling while the large voids at the intersection of orthogonal yarns are included in the yarn-scale modeling. Experiments are conducted to measure the thermal conductivities of plain woven C/SiC samples from room temperature to 800â¯Â°C temperature. The satisfied agreement with experimental data has highlighted the predictive capability of the proposed micromechanical model. Finally, a parametric study is performed using the presented model to investigate the effects of PyC interphase thermal conductance and manufacture-induced voids on the thermal conductivities of composite.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Composite Structures - Volume 193, 1 June 2018, Pages 212-223
Journal: Composite Structures - Volume 193, 1 June 2018, Pages 212-223
نویسندگان
Yingjie Xu, Shixuan Ren, Weihong Zhang,