Electroless plating of copper layer on surfaces of urea-formaldehyde microcapsule particles containing paraffin for low infrared emissivity

- UFP microcapsules with paraffin core and urea-formaldehyde shell were electroless-plated by copper.
- The lowest infrared emissivity achieved by electroless copper plating was 0.68.
- UFP with copper mass increase of 300% had balanced infrared emissivity and phase-change enthalpy.