کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
674415 | 1459561 | 2011 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermal analysis of power LED employing dual interface method and water flow as a cooling system
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
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چکیده انگلیسی
⺠This work was done based on the thermal characterization of a single chip light emitting diode (LEDs). ⺠Dual interface method using 2 different kinds of interface materials were employed. Study was done by comparing thermal paste and mylar tape as interface materials. ⺠The cooling curves were then converted into structure functions. The complete thermal profile of the device under test was studied where the exact point of junction to board thermal resistance was identified. ⺠Besides, a water flow system was reported in this work. It was revealed that water flow reduces the total real junction to ambient thermal resistance by 55.6%.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thermochimica Acta - Volume 523, Issues 1â2, 20 August 2011, Pages 237-244
Journal: Thermochimica Acta - Volume 523, Issues 1â2, 20 August 2011, Pages 237-244
نویسندگان
P. Anithambigai, K. Dinash, D. Mutharasu, S. Shanmugan, Choon Kim Lim,