کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
674415 1459561 2011 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal analysis of power LED employing dual interface method and water flow as a cooling system
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
Thermal analysis of power LED employing dual interface method and water flow as a cooling system
چکیده انگلیسی
► This work was done based on the thermal characterization of a single chip light emitting diode (LEDs). ► Dual interface method using 2 different kinds of interface materials were employed. Study was done by comparing thermal paste and mylar tape as interface materials. ► The cooling curves were then converted into structure functions. The complete thermal profile of the device under test was studied where the exact point of junction to board thermal resistance was identified. ► Besides, a water flow system was reported in this work. It was revealed that water flow reduces the total real junction to ambient thermal resistance by 55.6%.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thermochimica Acta - Volume 523, Issues 1–2, 20 August 2011, Pages 237-244
نویسندگان
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