Thermal analysis of power LED employing dual interface method and water flow as a cooling system

► This work was done based on the thermal characterization of a single chip light emitting diode (LEDs). ► Dual interface method using 2 different kinds of interface materials were employed. Study was done by comparing thermal paste and mylar tape as interface materials. ► The cooling curves were then converted into structure functions. The complete thermal profile of the device under test was studied where the exact point of junction to board thermal resistance was identified. ► Besides, a water flow system was reported in this work. It was revealed that water flow reduces the total real junction to ambient thermal resistance by 55.6%.