کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
675140 1459589 2009 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal analysis of loop heat pipe used for high-power LED
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
Thermal analysis of loop heat pipe used for high-power LED
چکیده انگلیسی

The goal of this study is to improve the thermal characteristics of high-power LED (light emitting diode) package by using a loop heat pipe. The heat-release characteristics of high-power LED package are analyzed and a novel loop heat pipe (LHP) cooling device for high-power LED is developed. The thermal capabilities, including start-up performance, temperature uniformity and thermal resistance of loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicates that the thermal resistance of the heat pipe heat sink is in the range of 0.19–3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5 °C, and the junction temperature of high-power LED could be controlled steadily under 100 °C for the heat load of 100 W.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thermochimica Acta - Volume 493, Issues 1–2, 10 September 2009, Pages 25–29
نویسندگان
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