کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6945491 | 1450514 | 2018 | 14 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs](/preview/png/6945491.png)
چکیده انگلیسی
The research and design of liquid-cooled integrated circuits (IC) relies heavily on accurate simulation. Ideally, finite-element-method (FEM) based tools should be used for this purpose. However, in most cases a fully coupled thermo-fluidic simulation of complex ICs is very long, mostly due to the fact that the simulation of fluid dynamics is very time consuming. Therefore, in this paper we propose a novel model for thermal simulation of ICs cooled by integrated microchannels which significantly reduces the simulation time. The new approach is based on removing the fluid from the model and treating the solid-liquid boundary as a convective boundary, described by the convection equation. It is shown that the proposed model offers very good accuracy in steady-state, with errors below 3â¯Â°C in every chip point. In transient domain the results are equally good, with the maximum error around 3.3â¯Â°C (6% relative error). Moreover, the simulation times have been reduced by about two orders of magnitude with respect to fully coupled FEM simulation. However, the proposed model has also important limitations: currently ICs with only one layer of straight microchannels are supported and the model requires recalculation if some chip parameters are changed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 87, August 2018, Pages 245-258
Journal: Microelectronics Reliability - Volume 87, August 2018, Pages 245-258
نویسندگان
Piotr ZajÄ
c, Andrzej Napieralski,