کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
6946116 1450522 2017 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
چکیده انگلیسی
The influence of via density and passivation thickness on the mechanical integrity of Back-End-Of-Line (BEOL) interconnects under Chip Package Interaction (CPI) loading is evaluated using a dedicated package test chip with 4 metal layers, and advanced copper/low-k processing. The reliability assessment is done using thermal cycling reliability tests, where two dedicated resistance based CPI test structures are analyzed. The data show a correlation between via density and reliability for both passivation modules, where a higher via density reduces the number of failures. In addition, the influence of passivation thickness was determined, where a thinner passivation results in a reduced number of failures. In order to visualize the failures, the interconnect stack was exposed after mechanical removal of the package overmold and Si etching. Cracks were present at the corner of the test chip.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 79, December 2017, Pages 297-305
نویسندگان
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