کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6946320 | 1450542 | 2016 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
On the avalanche ruggedness of optimized termination structure for 600Â V punch-through IGBTs
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
In this paper, the current paths in avalanche conditions of a Floating Field Ring (FFR) termination for a Punch-Through (PT) Insulated Gate Bipolar Transistor (IGBT) are analyzed. The design of the termination region is achieved with two different optimization techniques, and both static and dynamic electrical behavior are analyzed by means of 2D TCAD simulations, up to high current density levels. A comprehensive analysis of the Unclamped Inductive Switching (UIS) operation of the proposed terminations is carried-out with electro-thermal simulations. Although the behavior of both structures at low current levels is different, results show the same current crowding effect at the main junction for high current levels, resulting in a reduced conduction area of the overall termination, hence, of the avalanche reliability. Finally, experimental confirmation of filamentary current conduction during UIS test are detected on 600Â V commercial devices by means of transient infrared thermography.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 58, March 2016, Pages 17-25
Journal: Microelectronics Reliability - Volume 58, March 2016, Pages 17-25
نویسندگان
Paolo Mirone, Luca Maresca, Michele Riccio, Giovanni Breglio, Andrea Irace,