Thermal overstress of Cu wire under pulsed current condition

Copper wire introduction in IC industry is showing new and interesting challenges. In this paper, we present the experimental observations and theoretical hypothesis of copper wire degradation under thermal stress in pulsed current condition. The real case is a smart power test vehicle which fails under stress induced by Operating Life Test. Physical failure analysis results and theoretical thermal simulations are reported, as well as a failure mechanism hypothesis, which highlights product/package interaction sensitivity.