کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
6947306 1450551 2011 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Analysis of critical-length data from Electromigration failure studies
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Analysis of critical-length data from Electromigration failure studies
چکیده انگلیسی
An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length, either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift velocity. This paper provides an alternative interpretation of results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 51, Issues 9–11, September–November 2011, Pages 1568-1572
نویسندگان
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