Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test

► The power cycling test is conducted based on IEC standard. ► Coupled electro-thermal and thermal-mechanical finite element analysis are proposed. ► Validation of the test data and simulation results is within a reasonable range. ► Compressive stress occurs at the wire/chip interface. ► Major driving force contributing to the interface is the wire bump self-expansion.