Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading

► We tested warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading. ► We used two solders, fully annealed and as-received Cu plates, and three thickness ratios of the Si and Cu layers. ► Either the cyclic growth or the cyclic recovery of warpage occurred in the layered plates. ► The cyclic growth/recovery of warpage was simulated well using appropriate material models in FE analysis.