Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps

► First separated simulation of the Cu and Sn migration in Cu6Sn5 and Cu3Sn. ► Identification of reasons for the void formation at Cu6Sn5/Cu3Sn interfaces. ► Determination of the averaged effective ionic charge (Z∗) of Cu6Sn5 and Cu3Sn. ► Comparison between the electromigration induced mass flux in Cu-Sn IMCs and SAC. ► Identification of reasons for void formation at SAC/IMC interfaces.