Study of transient heat transfer and synchronized flow visualizations during sub-cooled flow boiling in a small aspect ratio microchannel

The challenges that microchannel flow boiling technology faces are the lack of understanding of underlying mechanisms of heat transfer during various flow boiling regimes and a dearth of analytical models that can predict heat transfer. This paper aims to understand flow boiling heat transfer mechanisms by analyzing results obtained by synchronously captured high-speed flow visualizations with local, transient temperature data. Using Inverse Heat Conduction Problem (IHCP) solution methodology, the transient wetted surface heat flux and temperature as well as heat transfer coefficient are calculated. These are then correlated with the visual data. Experiments are performed on a single microchannel embedded with fast response temperature sensors located (630 µm) below the wetted surface. The height, width and length of the microchannel are 0.42 mm, 2.54 mm and 25.4 mm respectively. De-ionized, de-gassed water is used as the working fluid. Two heat fluxes are tested at each of the mass fluxes of 182 kg/(m2s) and 380 kg/(m2s). Because of vapor confinement, slug flow is observed for the tested conditions. The present study provides detailed insights into the effect of various events such as passage of vapor slug, 3-phase contact line, partial-dry-out and liquid slug on transient heat transfer coefficient. Transient heat transfer coefficient peaks when thin film evaporation mechanism is prevalent. The peak value is influenced by the distance of bubble incipience as well as downstream events obstructing the flow. Heat transfer coefficient during the passage of liquid slug and 3-phase contact line were relatively lower for the tested experimental conditions.