کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7133336 | 1461821 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
الکتروشیمی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging](/preview/png/7133336.png)
چکیده انگلیسی
Hermetic packaging plays an important role for optimizing the functionality and reliability of a wide variety of micro-electro-mechanical systems (MEMS). In this paper, we propose a low-temperature wafer-level hermetic packaging method based on the thermo-compression bonding process using an electroplated Cu sealing frame planarized by a single-point diamond mechanical fly-cutting. This technology has an inherent possibility of hermetic sealing and electrical contact as well as a capability of integration of micro-structured wafers. Hermetic sealing can be realized with the sealing frame as narrow as 30â¯Î¼m at a temperature as low as 250â¯Â°C. At such a low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100â¯Pa. The leak rate into the packages is estimated by a long-term sealed cavity pressure measurement for 7 months to be less than 1.67â¯Ãâ¯10â15â¯Paâ¯m3â¯sâ1. In addition, the bonding shear strength is also evaluated to be higher than 100â¯MPa.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Sensors and Actuators A: Physical - Volume 279, 15 August 2018, Pages 671-679
Journal: Sensors and Actuators A: Physical - Volume 279, 15 August 2018, Pages 671-679
نویسندگان
Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka,