Sound insulation performance of plates with interconnected distributed piezoelectric patches

This paper deals with the sound insulation performance of a thin plate with interconnected distributed piezoelectric patches. Piezoelectric patches are periodically bonded on the surfaces of the plate in a collocated fashion, and are interconnected via an inductive circuit network. This piezoelectric system is termed as piezo-electromechanical (PEM) plate in the paper. Homogenization methods are involved under a sub-wavelength assumption to analytically develop the dynamical equations for the PEM plate. The dispersion relationships and energy densities of the wave modes propagating in the PEM plate are studied; the sub-wavelength assumption is verified for the simulations in this paper. The coincidence frequency of the PEM plate is researched, and results show that the coincidence frequency of the PEM plate will disappear at certain circumstances; mathematical and physical explanations are made for this phenomenon. The disappearance of the coincidence frequency is used to optimize the value of inductance, for the purpose of improving the sound transmission loss of the PEM plate.