کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7170924 1463453 2018 12 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal and ultrasonic bonding between planar polyethylene terephthalate, acrylonitrile butadiene styrene, and polycarbonate substrates
ترجمه فارسی عنوان
پیوند حرارتی و اولتراسونیک بین پلی اتیلن ترفتالات مسطح، استریل بوتادین آکریلونیتریل و زیر پوسته پلی کربنات
کلمات کلیدی
پلاستیک، دمای انتقال شیشه، تجزیه و تحلیل حرارتی، کشش مکانیکی، پیوند،
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
چکیده انگلیسی
Polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), and polycarbonate (PC) have seldom been used as substrate materials in chemical and biochips. Here, identical planar PET, ABS, or PC substrates with a thickness of 1 mm were bonded thermally or ultrasonically. Thermal bonding conditions were found by increasing the experimental temperature above the glass transition temperature (Tg) of each polymer. The temperature of each bonding interface should reach Tg. Ultrasonic bonding was achieved when a longitudinal wave of ultrasonic vibration was changed efficiently to friction heat between the bonding interfaces. This phenomenon was promoted by attaching one of the polymer substrates to the ultrasonic horn by vacuum chucking. Using the developed bonding method, the bonding strength that was obtained was approximately ten times the maximum value reported previously. As choices for the substrate material of polymer chips increase, the experimental environments that can be realized in chips will greatly expand.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Adhesion and Adhesives - Volume 84, August 2018, Pages 394-405
نویسندگان
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