کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7171004 | 1463456 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
In-situ chemical structure analysis of aqueous vinyl polymer solution-isocyanate adhesive in post-cure process by using Fourier transform near infrared spectroscopy
ترجمه فارسی عنوان
تجزیه و تحلیل ساختار شیمیایی داخل محلول چسب وینیل پلیمری محلول-ایزوسیانات در فرایند پس از درمان با استفاده از تبدیل فوریه در نزدیکی طیف سنجی مادون قرمز
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
چکیده انگلیسی
API (aqueous vinyl polymer solution-isocyanate) adhesive was prepared from PVA (polyvinyl alcohol) aqueous solution, SBR (styrene-butadiene rubber) latex and pMDI (polymethylene polyphenyl polyisocyanate). A paper sample was prepared by sandwiching API adhesive between two pieces of filter paper, which could be regarded as the model for an actual bonded structure in a practical application. In a post-cure process an in-situ chemical structure analysis of the adhesive layer in the paper sample was carried out using FT-NIR (Fourier transform near infrared) spectroscopy. The absorption bands of urea and urethane, two primary products generated from the chemical reactions of isocyanates, were assigned on a 2nd derivative spectrum at 5005Â cm-1 and 5065Â cm-1, respectively. Band intensities of urea and urethane increased with time during the post-cure process, indicating the advance of chemical reactions in the adhesive layer. DSC was utilized to analyze the thermal properties of the API adhesive film sample, together with the cross-linking density in the API adhesive film sample which was tested using DMA. In addition, FT-IR spectroscopy was used to confirm the chemical reactions of isocyanate in the API adhesive thin film sample.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Adhesion and Adhesives - Volume 81, March 2018, Pages 56-64
Journal: International Journal of Adhesion and Adhesives - Volume 81, March 2018, Pages 56-64
نویسندگان
Zhigang Ling, Yuuki Omura, Naruhito Hori, Tadahisa Iwata, Akio Takemura,