کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7173107 | 1464041 | 2017 | 14 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Study of rate dependent behavior of glass/epoxy composites with nanofillers using non-contact strain measurement
ترجمه فارسی عنوان
بررسی رفتار وابسته به سرعت کامپوزیت های شیشه ای / اپوکسی با استفاده از نانوفیلرها با استفاده از اندازه گیری فشار بدون تماس
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
چکیده انگلیسی
The present research work discusses the effect of strain rate and clay on the dynamic tensile behavior of glass/epoxy composites. Nanocomposites of different clay content in terms of 1.5, 3 and 5Â wt% are chosen for the study. Characterization of the nanoclay dispersed in epoxy system is investigated by X-ray Diffraction (XRD) and Fourier Transform Infra-red Spectroscopy (FT-IR), respectively. The non-contact Digital Image Correlation (DIC) technique is used for full-field strain measurement during dynamic loading using high speed CMOS camera. Stress-strain measurements are reported for glass/epoxy/clay nanocomposites over a wide range of strain rates from 0.001 to 450Â sâ1 and the variation of modulus, strength and strain to failure with strain rate are studied. A non-linear regression function is used to predict the tensile properties of glass/epoxy and its clay nanocomposites. The results show that the tensile strength and stiffness increase with increase in strain rate for neat glass/epoxy and its clay nanocomposites. An improvement in tensile modulus and strength is achieved with the addition of nanoclay. The fractography of tensile specimens is investigated using scanning electron microscopy (SEM) to discern the surface features and dispersion state of clay.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Impact Engineering - Volume 110, December 2017, Pages 324-337
Journal: International Journal of Impact Engineering - Volume 110, December 2017, Pages 324-337
نویسندگان
S. Gurusideswar, R. Velmurugan, N.K. Gupta,