Microstructural dependence of magnetoresistance in CuAg alloy solidified with high magnetic field

External high magnetic field (HMF) was used to modify the solidified microstructure and the electrical resistance of both Cu-28 wt%Ag alloy and Cu-72 wt%Ag eutectic alloy. The interface scattering model was used to estimate the electrical resistivity of both alloys, considering the effect of HMF on both the solubility of Ag and the microstructure parameters of the alloy. HMF increased the solubility of Ag in proeutectic Cu, thus increased the resistivity. Magnetoresistance (MR) of both alloys was measured in a 31-T resistive high magnetic field. The solidification of both alloys under HMF resulted in increased MR values. Cu-Ag alloy with both high solubility of Ag and high electrical resistivity was found to have high MR.