Selective copper metallization of nonconductive materials using jet-circulating electrodeposition

In this paper, a novel selective copper metallization technique that can be used on various materials, such as glass, plastic and ceramic, is proposed. The process consists of three steps: seed layer development, pattern fabrication using jet-circulating electrodeposition, and seed layer removal. A copper seed layer for electrodeposition was formed on various materials by electron beam evaporation. Jet-circulating electrodeposition was implemented to fabricate micro-metal patterns. Localizing the circulation of a jetted electrolyte through two concentric nozzles enables rapid selective electrodeposition. The geometry of the copper pattern was investigated by means of scanning electron microscopy (SEM) and a surface profiler. As a result, copper pattern in various shapes was fabricated. The usage of an outer diameter of 290 μm electrode nozzle, results in a copper pattern with a width of 430 μm and a height of 28 μm. Parameter study of the jet-circulating electrodeposition condition to investigate the electrodeposition mode, electrolyte jetting pressure, and average current was performed to control the width, height and surface roughness of the deposited pattern.