Curved drilling via inner hole laser reflection

In this paper, we describe curved hole drilling via the reflection of a laser beam off the sidewall of the drilled hole. A slightly offset laser beam forms a tilted surface at the bottom of the hole, controlling the angle of curvature. An ultraviolet laser beam operating at a wavelength of 266 nm was used. To visualize the hole formation process, borosilicate glass was used as the laser workpiece. This method was able to drill a curved hole with an average angle of ∼3° with curvature beginning at a depth of 400-600 μm. A curved hole with a diameter of <50 μm was achieved. A branched hole was also demonstrated by using the reflection of the tilted sidewall. The curved hole formation process was recorded with a high speed camera. Once the ablated sidewall reached a certain depth, drilling ceased as the laser energy fell below the ablation threshold. Ultimately, judicious selection of an appropriate laser fluence and sidewall angle allow the formation of curved holes.