کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7220708 1470330 2015 27 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effects of Fe2NiO4 nanoparticles addition into lead free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
Effects of Fe2NiO4 nanoparticles addition into lead free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
چکیده انگلیسی
This study investigates the effects of the addition of Fe2NiO4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe2NiO4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper 'sandwich' method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe2NiO4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe2NiO4 nanoparticles, respectively. If the addition of Fe2NiO4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 67, 15 February 2015, Pages 197-208
نویسندگان
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