Development of an integrated optical system for warpage and hermeticity test of microdisplay

We have developed an integrated optical system to measure the warpage of a microdisplay product at post-packaging die-attach temperature and to test its hermeticity after manufacturing. This system is constructed based on the principle of Twyman/Green (T/G) interferometry and Newton interferometry. T/G interferometry is used to characterize warpage of the microdisplay's base-plate, while Newton interferometry is used to characterize the gap variance between face-plate and base-plate of the microdisplay. With these measurements, deformation and shape of the microdisplay can be comprehensively determined during its manufacturing process, which is critical for its quality test and reliability evaluation. Delicate mechanical system was designed to facilitate the optics integration and alignment. To evaluate the performance of the optical system itself, warpage of a sample was re-measured with Tailor–Hobson profilometer whose resolution is 10 nm, the results from these two testing systems agree well with each other. Some application examples of the integrated testing system were presented to verify its work efficiency.