Keywords: تلنگر; hybrid thermoplastic composites; intrinsic hybridization; injection molding; overmolding; online process monitoring; interface bonding strength; warpage;
مقالات ISI تلنگر (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: تلنگر; BGA solder; Stand-off stiffness; Lamination plate; Warpage; Yield;
Keywords: تلنگر; Approximate integration scheme; Dimension reduction; Probability density function; Assembly yield; Warpage; Stacked die thin flat ball grid array;
Keywords: تلنگر; Selected laser sintering; Warpage; Optimization; FEM;
Keywords: تلنگر; Solid oxide fuel cell; Warpage; Cell size; Load density; Scaling up;
Keywords: تلنگر; PI/Cu composite; Stress evolution; Warpage
Keywords: تلنگر; In-mold decoration; In-mold roller; Heat retardation effect; Warpage; Heat transfer; Cooling system design
Keywords: تلنگر; Solid oxide fuel cell; Warpage; Cell shape; Planar anode-supported cell; Tape casting;
Keywords: تلنگر; Viscoelasticity; Storage modulus; Relaxation modulus; Interconversion; Poisson's ratio; Warpage
Keywords: تلنگر; Injection molding; Neutral axis theory; Thin-walled molding; Warpage;
Keywords: تلنگر; External gas-assisted injection molding; eGAIM; Headlight lampshades; Injection molding; Volumetric shrinkage; Warpage
Keywords: تلنگر; Composites; Fibre Metal Laminates; GLARE; Cure shrinkage; Warpage; Residual stress;
Keywords: تلنگر; Wafer level underfill (WLUF); Microbumps; Warpage; FEA; 3D ICs
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method
Keywords: تلنگر; Digital image correlation; Electronic package; Reliability assessment; Warpage;
Warpage simulation and experimental verification for 320â¯mmâ¯Ãâ¯320â¯mm panel level fan-out packaging based on die-first process
Keywords: تلنگر; Fan-out packaging; Die-first; Panel level; Warpage; Simulation; Experimental verification;
Geometrical deviation analysis of CFRP thin laminate assemblies: Numerical and experimental results
Keywords: تلنگر; Composites; Spring-in; Warpage; Tolerance analysis; Assembly;
Optimisation of Injection Moulding Parameter towards Shrinkage and Warpage for Polypropylene-Nanoclay-Gigantochloa Scortechinii Nanocomposites
Keywords: تلنگر; Injection moulding; polypropylene; nanoclay; Gigantochloa Scortechinii; Taguchi Optimisation Method; shrinkage; warpage;
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding
Keywords: تلنگر; Thermo-compression bonding; Flip Chip; Piezoresistive; Advanced packaging; Warpage; Tilt; Au bumps; Reliability; Interconnect; Thermal gradient;
Flatness enhancement of the embedded interposer of 3D-ICs by using ring-type framework designs
Keywords: تلنگر; Warpage; Embedded interposer carrier; Finite element analysis; 3D-ICs; Film laminations; Ring-type frame
Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress
Keywords: تلنگر; BGA solder; Fatigue fracture; Crack interface; Warpage; Tensile stress
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
Keywords: تلنگر; Package stress; Simulation; Through silicon via (TSV) interposer; Warpage; 2.5D package;
Wafer level Cu-Cu direct bonding for 3D integration
Keywords: تلنگر; 3D IC; Wafer-to-wafer; Wafer level stacking; Warpage; Thermo-compression bonding;
Optimization for warpage and residual stress due to reflow process in IGBT modules based on pre-warped substrate
Keywords: تلنگر; IGBT; Warpage; Reflow; Pre-warping;
Improving the FE simulation of molded packages using warpage measurements
Keywords: تلنگر; Reliability; Warpage; Finite element methods; Thermoiré; Mold compound; Aging;
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages
Keywords: تلنگر; Through silicon via (TSV); Warpage; Keep-out zone (KOZ); Mobility change; Stress; 3D IC package;
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
Keywords: تلنگر; Insulated gate bipolar transistor (IGBT); Warpage; Finite element analysis; Direct bonded copper (DBC); Assembly
Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages
Keywords: تلنگر; Non-destructive; X-ray diffraction; Stress; Integrated circuit; Embedded QFN package; Warpage;
Effects of insert film on asymmetric mold temperature and associated part warpage during in-mold decoration injection molding of PP parts
Keywords: تلنگر; In-mold decoration; Injection molding; Heat transfer retardation; Film insert; Warpage; Polymer processing; Heat transfer
Influência do tratamento térmico no empenamento de latão durante o processo de usinagem por fresamento de topo
Keywords: تلنگر; latão; usinagem; empenamento; tratamento térmico.; brass; machining; warpage; heat treatment.;
Analysis of the thermal stress and warpage induced by soldering in monocrystalline silicon cells
Keywords: تلنگر; Silicon cell; Soldering; Finite element method (FEM); Warpage; Thermal stress
Research on the reduction of sink mark and warpage of the molded part in rapid heat cycle molding process
Keywords: تلنگر; Injection molding; Rapid heat cycle molding; Warpage; Sink mark
Wafer warpage analysis of stacked wafers for 3D integration
Keywords: تلنگر; Wafer stacking; Warpage; Cu bonding; Coefficient of thermal expansion; 3D integration
On the relationship between cooling setup and warpage in injection molding
Keywords: تلنگر; Injection; Cooling; Warpage; Measurement
The die turning injection (DTI) process for the fabrication of hollow parts
Keywords: تلنگر; Die turning injection (DTI) process; Finite element method; Hollow nozzle; Die sliding injection (DSI) process; Warpage; Cooling channel
Stress analysis of stacked Si wafer in 3D WLP
Keywords: تلنگر; Wafer stacking; Cu bonding; TEM; CBED; Warpage
Test method development for deformation analysis of injection moulded plastic parts
Keywords: تلنگر; Warpage; Corner effect; Injection moulding; Deformation; Injection mould;
An inverse analysis of warpage for trilayer thin-plate under thermal cycles
Keywords: تلنگر; Thin multilayer structure; Warpage; Thermal analysis; Thermal cycle
Simulation and experimental study in determining injection molding process parameters for thin-shell plastic parts via design of experiments analysis
Keywords: تلنگر; Injection molding; Mold-Flow analyses; Warpage; DOE; Optimization
Surrogate-based process optimization for reducing warpage in injection molding
Keywords: تلنگر; Injection molding; Warpage; Kriging surrogate model; Design of experiment; Expected improvement
Warpage and structural analysis of thin shell plastic in the plastic injection molding
Keywords: تلنگر; Plastic injection molding; Thin shell part; Structural analysis; Warpage; Taguchi
Characterization of warpage behaviour of Gd-doped ceria/NiO–yttria stabilized zirconia bi-layer samples for solid oxide fuel cell application
Keywords: تلنگر; Continuum mechanics; Co-firing; Warpage; Solid oxide fuel cell; Viscoelastic analysis; Anode-support
Study on the thermoforming of PC films used for in-mold decoration
Keywords: تلنگر; Thermoforming; Stretching ratio; Warpage; In-mold decoration
Combining radial basis function neural network and genetic algorithm to improve HDD driver IC chip scale package assembly yield
Keywords: تلنگر; Driver IC; Warpage; Assembly yield; RBFN; GA
Influence of using pulsed cooling for mold temperature control on microgroove duplication accuracy and warpage of the Blu-ray Disc
Keywords: تلنگر; Pulsed cooling; Blu-ray Disc; Microgroove duplication accuracy; Warpage
Controlling warpage of molded package for inkjet manufacturing
Keywords: تلنگر; FE modeling; Encapsulation; Molding; Warpage; Inkjet
Computational analysis of injection-molding residual-stress development in direct-adhesion polymer-to-metal hybrid body-in-white components
Keywords: تلنگر; Polymer metal hybrids; Residual stresses; Warpage; Automotive structural components
Application of Taguchi optimization technique in determining plastic injection molding process parameters for a thin-shell part
Keywords: تلنگر; Design of experiment; Plastic injection molding; Taguchi optimization technique; The S/N ratio; Analysis of variance; Shrinkage; Warpage
The use of Taguchi method in the design of plastic injection mould for reducing warpage
Keywords: تلنگر; Plastic injection mould; Taguchi methods; Experimental design; Warpage
Development of an integrated optical system for warpage and hermeticity test of microdisplay
Keywords: تلنگر; Microdisplay; Warpage; Hermeticity; Twyman/Green interferometry
A solution for warpage in polymeric products by plug-assisted thermoforming
Keywords: تلنگر; Warpage; Plug-assist thermoforming; High temperature